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Product ID: RK-1689 Date Of Manufacture: 2006 Product Details: Options:
Component shuttle
Board cooler
Fume extraction manifold
Site clean (nozzle not included)
4 additional thermocouple ports (8 in total)
Model Specifications: Onyx29 Applications
Lead-Free, 0201, Flip Chip, Micro BGA/CSP, MEMS, Optoelectronics, Microwave, MLF’s and other devices. Existing technology including BGA, CSP, Leaded Devices and Surface Mount Connectors can also be easily accommodated.
Key Benefits:
• 9 micron placement accuracy (0.0003”) @ 3 Sigma
• High volume rework
• Ultra-fast heat up for Lead-Free Rework
• Fast, controlled board cool down
• Process repeatability
• Uniform joint temperature
• Precision air flow
• Simple, fast & easy to use software
• Large, clear images for component alignment
• Components up to 3.0” (75mm)
• Micro site cleaning
• Clean and uniform pads for replacement device
• Solder dots or lines down to 0.010”
• Dispensing of solder paste, epoxy, under fill or flux
Key Specifications:
• Board size minimum = 3.0"W
• Board size maximum = 20.0"W x Unlimited
• Top and bottom side clearance = 1.20" (optional 2.75")
• Bottom heating: 19" x 19", 4 zones, 6000 watts
• Axes speed (X,Y,Z) = .15 ms
• Axes resolution (X,Y,Z) = .001 mm
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