SIPLACE S is the best-in-class solution among flexible high-speed systems. This very compact machine features a footprint of only 4 m2 and is designed for high volume placement with maximum modularity and flexibility. SIPLACE S is equipped with two collect-and-place revolver heads, enabling placement rates of up to 27,000 cph per module.

Two 12-nozzle heads for high-speed placement of 0201s up to 18.7 x 18.7 mm
 
Two 6-nozzles heads (with optional DCA package) for high-speed placement of 0603s up to ICs with 32 x 32 mm

One 6-nozzle head (with optional DCA package) and one 12-nozzle head for components ranging from 0201s to 32 x 32 mm