Product ID:  C770
Date Of Manufacture:   1998





Product Details:

Silver Camera ( No 2d or 3d)
Vacuum under stencil wipe with solvent system


Model Specifications:

Equipment Model DEK 265 GSX
General Length (inches) 51.7
Width (inches) 55.3
Height (inches) 57.4
Automation Fully automatic
Board Handling Maximum size (inches) 20.1x20
Minimum size (inches) 2.8x1.5
Maximum thickness (") 0.016
Minimum thickness (") 0.25
Maximum warpage (") 0.28
Underside component clearance (inches) 0.12 to 1
Board held by Edge clamp, vacuum, other
Board support Magnetic pins, tooling pins, vacuum plate
Conveyor Standard
Board Movement R to L, L to R
Dual-lane board handling? Yes


Print Head Print area (inches) 20 x 19.5
Maximum print stroke(") 2.2 to 22.3
Mdthod of registration Vision
Optical alignment? Yes
Alignment accuracy (microns) ±25
Alignment repeatability (microns) 25
Print Modes Print/print, print/flood, flood/print, on contact, 1 or 2 deposits
Print speed (inches/second) 0.08 to 5.9
Print pressure (pounds) 0 to 44
Snap off (print gap) (inches) 0 to 0.24
Is snap-off programmable? Yes
Cycle time (seconds) Single lane: <10
Stencil Frame size (inches) 29x29
PCB stencil seperation speed (inches/second) 0.04 to 0.79
Stencil cleaning Dry, wet, vacuum
Programmable? Yes
Stencil Wiper Optional
Squeegee Squeegees Metal, polyurethane, other
Squeegee pressure (pounds) 0 to 44
Where measured? N/A
Horizontal or central pivot? Horizontal


Vision system Type On the move
Field of vision (inches) 0.25x0.31
SMEMA fiducial standard compatible? Yes
Align calibration Full automatic
Post-print inspection available? 2-D
Program Up and down line protocol SMEMA, SECS, GEM
Number of programs stored 1000+

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