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TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019)

TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019)

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TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019) TK1213 - ASC VisionPro M500 3D Solder Paste Inspection System (2019)
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Brand: ASC
Product Code: VisionPro M500 3D Solder Paste Inspection System
Availability: In Stock
Price: $0.00
Ex Tax: $0.00

ASC VisionPro M500 3D Solder Paste Inspection System (2019)

Brand: ASC International
Model: M500 3D Solder Paste Inspection System
S/N: PSI-107
Year: 2019
Software: ASCan ULTRA Version 2.4.4.5
O/S: Windows 10 Pro

System Specifications
Maximum Object Thickness: 5.1 cm (2.0 inches)
Standard Work Surface (WxL): 41 x 53 cm (16 x 21in.) (Custom Size Avbl.)
Throat Depth (Sensor to Rear support): 38 cm (15 inches)
System Computer: Minimum: 2.5 GHz, 1.0 GB RAM, Windows OS
Electrical Requirements: 100 - 240 VAC, 50 - 60 Hz, 2 Amps
Ambient Operating Temperature: 5 to 38 C (40 to 100F)
Ambient Operating Humidity: <90% Non Condensing
System Weight: 36 Kg (80 lbs)
System Weight (CRATED): 59 Kg (130 lbs) (Not including PC & Monitor)
Measurement Capability: Height, Volume, Area, Width, Length, 3D Defect Analysis
SPC Charting/ Data Reports: Integrated
Work Instruction: Built In

Sensor Specifications
Measurement Principal: Phase Shift Interferometry (PSI)
Camera (Pixel): 1280 x 1024
Lateral Resolution: 6.8 µm (.27 mils)
FOV Size: 5.8 mm x 4.7 mm (230 mils x 184 mils)
Z Resolution: .48 µm (.019 mils)
Measurement Range: 488 µm (19.2 mils)
Illumination: LED Based White Light

Inspection Performance
Inspection Speed: 1 Second FOV 3D
Static Repeatability: 1 µm (.04 mils)
Gage R & R (+/- 50% tolerance on PCB): <10%
Height Accuracy on Cal Target: 1 µm (.04 mils)
Minimum Paste Deposit Size (X,Y): 51 µm (2 mils)

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