CyberOptics SE300 (2004) Solder Paste Inspection
Brand: CyberopticsModel: SE300Description: Solder Paste InspectionSerial: 10239Year: 2004
Details:
• MicroPad Sensor• Mechanical board stop• Auto-width adjust conveyor• Max pad size: 0.197” x 0.394”• Paste height range: 2-14mils• Height resolution: 0.005mils• Weight: 860 kg (1900 lbs.) • Process Insight SPC software• Max PCB width: 20” x 20”• Max inspection area: 20” x 19.5”• Board Thickness: 0.5 to 5 mm (0.02 to 0.2 in.) • Board Edge Clearance: Top: 2.5 mm (0.10 in.) Bottom: 3 mm (0.12 in.) Underside Component Clearance: 25.4 mm (1 in.) • GC-PowerPlace Gerber and ODB++ file conversion software for off-line programming• NIST-traceable measurement certification standard certified for height, area and volume• Measurement types: Height, Area, Volume, Registration, Bridge Detection
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