Koh Young 3D KY8030-L Solder Paste Inspection Machine (2008)
Brand: Koh Young 3D SPIModel: KY8030-LYear: 2008Serial #: SPI-8L110Machine Size: Large Max Panel Dimensions: 510mm x 510mm Min Panel Dimensions: 50mm x 50mm Maximum Panel Weight: 2kg PCB Thickness Range: 0.4~5mmPCB Handling: BeltHardware: 3D Inspection, Auto Conveyor AdjustmentOperations Software: Koh Young 3D Inspection HMI(3.5.2135)Additional Options: EPM (Progam Create)Measurement and Inspection Performance FPYÔºö 50~80%
SPI-S10 VERGUI Version: 3.5.2135 Vision Version: 1.1.11067 VisionTool 5.4.0 ,VPC 7.98 MCS Version: 760.09.17PCB Viewer: 3.4.476 Remote Version: 1.0.7STMC Rom Version: 0D_TOOL Version Motion B/D MMI Version Motion B/D OS Version: 3.18.01ePM-SPI Version: 1.1.9.0SPC plus Version: 1.2.0.601 Grabber Version
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