TK1020 - Parmi HS70 3D Solder Paste Inspector (2011)

PARMI HS70 3D Solder Paste Inspection Machine (2011)
Brand: ParmiModel: HS70 3D Solder Paste Inspection Machine (SPI) Serial #: H7S03811FYear: 2011
Machine Specifications: Software Version: Parmi 3D SPI v1.5.1.2Conveyor Inspection Program: Single Lane 1 stage conveyorSystem Diagnosis Up/down stream Interface:SMEMA II
Measurement:Measuring Principle: Shadow free Dual Laser Optical TriangulationInspection Type: Height, Area, Volume, Offset, Bridge, Shape, Warpage, PCB shrink
Camera Type RSC VI Specifications:X-Y Resolution: 18x9 j/mHeight Resolution: 0.1 j/mMax. Paste Height & Size: 1000 mm / 20x20 mmMin. Paste Size & Pitch: 150x150 mm / 100 mmInspection Speed: 80 sg.cm/secHeight Accuracy: 2 mm. on a certification targetHeight Repeatability: 3 Sigma ( 1 mm, on a certification targetArea Repeatability: 3 Sigma ( 1%, on a certification targetVolume Repeatability: 3 Sigma ( 1%, on a certification target
Board Specification:Gage R&R Maximum & Minimum Board Size: « 5 % - 430 x350Maximum Board Warp: ±5 mmBoard Thickness: 0.4 to 4 mmBoard Edge Clearance (TOP/Bottom): 2.5/4mmUnderside Clearance: 23 mm
System Dimensions:Dimensions (WxDxH): 970 x 1195 x 1535 mmWeight: 800 kgConveyor Height: 890 - 965 mm [SMEMA]Load, Unload Time: 3.0 secFlow Direction: Left-Right or Right-Left (Automatic)(Optional)
Hardware System:Conveyor Width Adjusting X-Y-Z robot: Auto Adjustable - Sensor head move in X-Y-Z axisComputer: Pentium IV Quad Core, 8GB Memory, MS-Windows XP Professional 64bitPower Supplies: Electric - AC 220V, 50/60 Hz, Pneumatic - 5Kgf/sq cm