Koh Young Technology KY8030-2 3D Solder Paste Inspection Machine (2012)Brand: Koh YoungModel: KY8030-2Serial number: SPI-82L-586Year of Manufacture: 2012Flow Direction: Left to Right
Inspection RangeMetrology Capability: Volume, Area, Height, Offset, Bridging and Shape DeformityTypes of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Inspection PerformanceCamera: 4M Pixel CameraMax. Paste Size: 10 x 10 µmMax Paste Height: 600 µmMin Distance between Paste Deposit: 100 µm (at 150 µm paste height)
PCB HandlingConveyor Width Adjustment: AutomaticConveyor Fix Type: FrontMax PCB size: 510 x 510 mmMin PCB size: 50 x 50mmPCB Thickness: 0.4 to 5.0mmMax PCB Weight: 2.0 kg
SoftwareStatistical Analysis Tool: SPC PlusOperating System: Windows XP
Dimensions (L x W X H): 1203 x 1000 x 1572 mmMachine Weight: 550 kgElectrical Supply: 200-240 VAC 1Ph 50/60HzAir Supply: 5 Kgf/cm2
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