TK1157 - Asscon VP2000-200 Vapor Phase Reflow Oven (2012)

Asscon VP2000-200 Vapor Phase Reflow Oven (2012)
Brand: AssconModel: VP2000-200Type: Vapor Phase Reflow Soldering OvenYear: 2012Serial #: 100-09/12
ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP2000 inline series are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series production. The innovative inline soldering system for large series users is based on the highly successful oxygen-free process used in all ASSCON soldering systems, in which oxygen is excluded from the pre-heating and soldering process. Components are produced in the highest standard of quality. Production is also supported by dynamic profiling – a process for automatically controlling the optimum soldering profile in series production. The system is designed for bare-board product processing on large series production lines. Electrically width-adjusted conveying systems and center support permit fast straightforward adjustment for flexible production. The system is modularly designed, and consists of loading station, soldering and cooling zones. The use of liquid or vapor for as a mean of energy transmission is far more effective than convection. The vapor condenses on the solder product, the condensate encapsulates it completely, and thus transmits the energy. The entire pre-heating and soldering process takes place in an oxygen-free environment. Product overheating, component damage or PCB delamination cannot occur. An optimum temperature is automatically guaranteed at all positions on the product thanks to infinite sensor-based temperature gradient controlling.
PCB Transport: Single laneMax PCB Dimension: 600 x 520mmMax Component Height: 90mm